Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

By Wen-Yee Lee TAIPEI, April 29 (Reuters) - Taiwan’s ASE Technology Holding, the world’s largest chip packaging and testing ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

During SEMICON 2026 Shanghai, our reporter interviewed Zhang Xiaofei, Chief TMT Analyst at Haitong International. The following are his personal views.

The Singapore semiconductor startup is expected to ship more than a billion devices including advanced chiplet-based products ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Taiwan’s ASE Technology Holding expects advanced chip packaging revenue to grow 10% to more than $3.5 billion in 2026, driven by surging demand for AI processors. The company, a major supplier for ...

Apple A20 chip to skip TSMC's WMCM packaging due to DRAM shortages, impacting iPhone 18 flexibility, and the progression of ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

In a significant step towards building a domestic semiconductor ecosystem, the Ministry of Electronics and IT on Saturday ...

Nvidia (NASDAQ: NVDA) currently accounts for an estimated 85% to 92% share of the AI accelerator market. However, as large ...